Applications

TGS-2500F

Features

    • 16-core Intel® Core™ Ultra 300H series processor (Series3, formerly Pather Lake-H) features advanced CPU+GPU+NPU hybrid architecture supporting max 100 TOPS for Edge and Physical AI
    • Innovative stackable design for expansion functions: Optional AI accelerator, USB, Isolated DIO, COM, LAN or 4G/LTE
    • 2 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C, 2 2.5GigE LAN
    • 3 M.2 Socket for storage and expansion, supports multiple 5G/WiFi/BT/4G/LTE
    • DC 24V Power Input, max -25°C to 55°C operation
    • Intel® Edge System Qualification (ESQ) Verified — Validated for vertical-based workloads & AI suitability
     
     
     

Overview

    The Vecow TGS-2000 Series is an ultra-compact, stackable embedded system designed for demanding edge applications like Medical Imaging, Smart City, and Intelligent Factory. It is powered by the high-performance 16-core Intel® Core™ Ultra 300H Series processor (Series 3) with an advanced CPU+GPU+NPU hybrid architecture, delivering up to 100 TOPS of compute power for next-generation Edge AI. Key features include an innovative stackable design for flexible expansion (Optional AI accelerator, USB, Isolated DIO, COM, LAN, or 4G/LTE), robust I/O with 2 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C, and 2 2.5GigE LAN, and three M.2 Sockets supporting multiple wireless connections. Built for rugged environments, it supports DC12V~24V or DC 24V Power Input and operates reliably across an extreme temperature range of -25°C to 55°C.

    This platform has achieved Intel® Edge System Qualification (ESQ) and is listed as an Intel® AI Edge System. By leveraging the OpenVINO™ toolkit to fully optimize CPU, GPU, and NPU performance, it is validated via vertical-based workloads to ensure the system is truly fit-for-purpose. This workload-aligned approach prevents over-provisioning, simplifying your evaluation while ensuring reliable deployment for Gen AI and Vision AI.

     

Specifications

System
Processor Intel® Core™ Ultra 9 386H Processor (formerly Panther Lake-H)
GPU - Built-in processor graphics Intel® Xe3 GPU
- Independent MXM Graphics: By request
NPU Integrated Intel® AI Boost Neural Processing Unit
Chipset Intel® SoC
BIOS AMI
SIO IT8659E
Memory 2 DDR5 6400MHz SO-DIMM, up to 128GB
OS Windows 11, Windows 10, Linux
I/O Interface
Display - 2 HDMI 2.1: Up to 4096 x 2304 @60Hz
- 1 DisplayPort 1.4: Up to 3840 x 2160 @60Hz by USB Type-C
- 2 DisplayPort 1.4: Up to 4096 x 2304 @60Hz (by MXM)
USB - 2 USB 3.2 Gen 2 Type A
- 2 USB 2.0 Type A
- 1 USB 3.2 Gen 2x2 Type C (5V/3A)
LED Power, HDD
Expansion
M.2 - 1 M.2 Key E Socket (2230, PCIe x1/USB 2.0)
- 1 M.2 Key B (3042/3052, PCIe x2/USB 2.0) with SIM
Docking Expansion 2 Expansion Connector for docking module
Storage 
M.2 1 M.2 Key M Socket (2280, PCIe 4.0 x4, up to 4TB)
Audio
Audio Codec Realtek ALC888S-VD, 7.1 Channel HD Audio 
Audio Interface 1 Mic-in, 1 Line-out
Ethernet
LAN 1 Intel® I226 2.5GigE LAN with iAMT
LAN 2 Intel® I226 2.5GigE LAN
Power
Power Input DC 24V 
Power Interface 3-pin Terminal Block:V+,V-, Frame Ground
Others
Watchdog Timer Reset : 1 to 255 sec./min. per step
HW Monitor Monitoring temperature, voltages. Auto throttling control when CPU overheats.
Mechanical
Dimension  117mm x 120mm x 114mm (4.61"x 4.72"x 4.49")
Weight 2.3 kg (5.07lb)
Mounting
- Wallmount by mounting bracket
- VESA Mount (Optional)
- DIN Rail Mount (Optional)
Environment
Operating Temperature -25°C to 55°C (-13°F to 131°F)
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% @55°C
Shock/
Vibration
- IEC 61373: 2010
- Railway Applications : Rolling Stock Equipment,
Shock and Vibration Tests
EMC CE, FCC, ICES, EN50155, EN50121-3-2

  

Resources

Item File Name Format File Update Download
TGS-2500F TGS-2000 DM (English) .PDF 2026/4/27 Download
TGS-2500F TGS-2000 User Manual .PDF 2026/5/4 Download
TGS-2500F TGS-2000 Series Product Brief .PDF 2026/3/10 Download

Inquiry

Product Description Qty
TGS-2500F-386H TGS-2500F, onboard Intel Core Ultra 9 386H, 1 2.5G LAN, 2 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C, 2 HDMI 2.1, 3 DP, MXM supported, DC 24V
DDR5 32G Certified DDR5 32GB 5600MHz/4800MHz RAM
DDR5 16G Certified DDR5 16GB 5600MHz/4800MHz RAM
DDR5 8G Certified DDR5 8GB 5600MHz/4800MHz RAM
PWA-120W1 120W, 24V, 90V AC to 264V AC Power Adapter with 3-pin Terminal Block
TGS-101 Expansion Docking Module for 16-bit GPIO
TGS-102 Expansion Docking Module for 16-bit Isolated DIO (8DI, 8DO)
TGS-103 Expansion Docking Module for Type A MXM GPU (Without MXM GPU)
TGS-104 Expansion Docking Module for 2 Isolated COM (RS-232/422/485)
TGS-105 Expansion Docking Module for 2 USB3
TGS-106 Expansion Docking Module for 2 1G LAN
TGS-107 Expansion Docking Module for 4G Module
DIN-RAIL DIN Rail Kit
VESA Mount VESA Mounting Kit
M.2 Storage Module M.2 Key M/Key B PCIe Storage Module
5G Module 5G Module with Antenna
4G Module Mini PCIe 4G/GPS Module with Antenna
WiFi & Bluetooth WiFi & Bluetooth Module with Antenna