产品信息

ECX-2200/2100 (M12)

ECX-2210MX (I350)

10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) with Workstation-grade Intel® W480E Chipset Expandable Fanless Embedded Workstation, 6 GigE LAN with 4 M12 PoE+, 2 front-access SSD trays, 1 PCIe x16 slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature

ECX-2201MX (I350)

10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) with Workstation-grade Intel® W480E Chipset Expandable Fanless Embedded Workstation, 6 GigE LAN with 4 M12 PoE+, 2 front-access SSD trays, 1 PCI slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature

ECX-2210 (I350)

10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) with Workstation-grade Intel® W480E Chipset Expandable Fanless Embedded Workstation, 6 GigE LAN with 4 PoE+, 2 front-access SSD trays, 1 PCIe x16 slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature

ECX-2201 (I350)

10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) with Workstation-grade Intel® W480E Chipset Expandable Fanless Embedded Workstation, 6 GigE LAN with 4 PoE+, 2 front-access SSD trays, 1 PCI slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature

ECX-2110 (I350)

10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) with Workstation-grade Intel® W480E Chipset Expandable Fanless Embedded Workstation, 2 GigE LAN, 2 front-access SSD trays, 1 PCIe x16, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 16 GPIO, High-Performance, Rugged, Extended Temperature

ECX-2101 (I350)

10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) with Workstation-grade Intel® W480E Chipset Expandable Fanless Embedded Workstation, 2 GigE LAN, 2 front-access SSD trays, 1 PCI slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 16 GPIO, High-Performance, Rugged, Extended Temperature

ECX-2210MXA (I210)

10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) with Workstation-grade Intel® W480E Chipset Expandable Fanless Embedded Workstation, 6 GigE LAN with 4 M12 PoE+, 2 front-access SSD trays, 1 PCIe x16 slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature

ECX-2201MXA (I210)

10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) with Workstation-grade Intel® W480E Chipset Expandable Fanless Embedded Workstation, 6 GigE LAN with 4 M12 PoE+, 2 front-access SSD trays, 1 PCI slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature

ECX-2210A (I210)

10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) with Workstation-grade Intel® W480E Chipset Expandable Fanless Embedded Workstation, 6 GigE LAN with 4 PoE+, 2 front-access SSD trays, 1 PCIe x16 slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature

ECX-2201A (I210)

10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) with Workstation-grade Intel® W480E Chipset Expandable Fanless Embedded Workstation, 6 GigE LAN with 4 PoE+, 2 front-access SSD trays, 1 PCI slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature

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